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Editorial
. 2001 Apr 24;98(9):4827-9.
doi: 10.1073/pnas.101134798.

The future of electronics manufacturing is revealed in the fine print

R G Nuzzo
Editorial

The future of electronics manufacturing is revealed in the fine print

R G Nuzzo. Proc Natl Acad Sci U S A. .
No abstract available

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Figures

Figure 1
Figure 1
Plastic display backplane circuits microfabricated using soft lithographic patterning methods (courtesy of F. Frankel, Massachusetts Institute of Technology, Cambridge).
Figure 2
Figure 2
A schematic depiction of the structure of a SAM formed by the adsorption of an n-alkane thiol on a gold surface (Upper). The physical properties of the surface can be controlled by substituting functional groups at the chain ends of the thiol adsorbate. In the example shown, the wafer presents carboxylic acid and methyl groups in the hydrophilic and hydrophobic regions, respectively (courtesy of G. Whitesides, Harvard University, Cambridge, MA).
See this image and copyright information in PMC

Comment on

References

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