Nanoscale thermal probing
- PMID: 22419968
- PMCID: PMC3303495
- DOI: 10.3402/nano.v3i0.11586
Nanoscale thermal probing
Abstract
Nanoscale novel devices have raised the demand for nanoscale thermal characterization that is critical for evaluating the device performance and durability. Achieving nanoscale spatial resolution and high accuracy in temperature measurement is very challenging due to the limitation of measurement pathways. In this review, we discuss four methodologies currently developed in nanoscale surface imaging and temperature measurement. To overcome the restriction of the conventional methods, the scanning thermal microscopy technique is widely used. From the perspective of measuring target, the optical feature size method can be applied by using either Raman or fluorescence thermometry. The near-field optical method that measures nanoscale temperature by focusing the optical field to a nano-sized region provides a non-contact and non-destructive way for nanoscale thermal probing. Although the resistance thermometry based on nano-sized thermal sensors is possible for nanoscale thermal probing, significant effort is still needed to reduce the size of the current sensors by using advanced fabrication techniques. At the same time, the development of nanoscale imaging techniques, such as fluorescence imaging, provides a great potential solution to resolve the nanoscale thermal probing problem.
Keywords: Raman spectroscopy resistance thermometry; feature size; nanoscale; near-field; scanning thermal microscopy.
Figures
References
-
- Cahill D, Ford W, Goodson K, Mahan G, Majumdar A, Maris H, et al. Nanoscale thermal transport. J Appl Phys. 2003;93:793–818.
-
- Kölzer J, Oesterschulze E, Deboy G. Thermal imaging and measurement techniques for electronic materials and devices. Microelectron Eng. 1996;31:251–70.
-
- Cahill DG, Goodson K, Majumdar A. Thermometry and thermal transport in micro/nanoscale solid-state devices and structures. J Heat Trans. 2002;124:223–41.
-
- Altet J, Claeys W, Dilhaire S, Rubio A. Dynamic surface temperature measurements in ICs. P IEEE. 2006;94:1519–33.
-
- Christofferson J, Maize K, Ezzahri Y, Shabani J, Wang X, Shakouri A. Microscale and nanoscale thermal characterization techniques. J Electron Packaging. 2008;130:041101–6.
LinkOut - more resources
Full Text Sources
Other Literature Sources