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. 2012 Mar;6(1):16505-1650516.
doi: 10.1063/1.3689939. Epub 2012 Mar 5.

A practical guide for the fabrication of microfluidic devices using glass and silicon

A practical guide for the fabrication of microfluidic devices using glass and silicon

Ciprian Iliescu et al. Biomicrofluidics. 2012 Mar.

Abstract

This paper describes the main protocols that are used for fabricating microfluidic devices from glass and silicon. Methods for micropatterning glass and silicon are surveyed, and their limitations are discussed. Bonding methods that can be used for joining these materials are summarized and key process parameters are indicated. The paper also outlines techniques for forming electrical connections between microfluidic devices and external circuits. A framework is proposed for the synthesis of a complete glass/silicon device fabrication flow.

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Figures

Figure 1
Figure 1
Setup for etching through-holes in (a) glass and (b) silicon.
Figure 2
Figure 2
Electrical feedthrough approaches: (a) lateral and (b) vertical. After the principle described by Esashi in Ref. .
Figure 3
Figure 3
Basic configurations of fluidic interconnects: (a) out-of-plane (top connector) and (b) in-plane (edge connector). The capillary is drawn showing both inner and outer diameters.
Figure 4
Figure 4
A PDMS connector makes intimate contact with the silicon chip because a dummy replica of the chip itself was used as a mould master Reprinted with permission from Saarela et al., Sens. Actuators B 114, 552 (2005). Copyright © 2005, Elsevier.

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