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. 2011 Dec;6(12):C12009.
doi: 10.1088/1748-0221/6/12/C12009.

Pixellated Cd(Zn)Te high-energy X-ray instrument

P Seller  1 , S Bell, R J Cernik, C Christodoulou, C K Egan, J A Gaskin, S Jacques, S Pani, B D Ramsey, C Reid, P J Sellin, J W Scuffham, R D Speller, M D Wilson, M C Veale
Affiliations

Pixellated Cd(Zn)Te high-energy X-ray instrument

P Seller et al. J Instrum. 2011 Dec.

Abstract

We have developed a pixellated high energy X-ray detector instrument to be used in a variety of imaging applications. The instrument consists of either a Cadmium Zinc Telluride or Cadmium Telluride (Cd(Zn)Te) detector bump-bonded to a large area ASIC and packaged with a high performance data acquisition system. The 80 by 80 pixels each of 250 μm by 250 μm give better than 1 keV FWHM energy resolution at 59.5 keV and 1.5 keV FWHM at 141 keV, at the same time providing a high speed imaging performance. This system uses a relatively simple wire-bonded interconnection scheme but this is being upgraded to allow multiple modules to be used with very small dead space. The readout system and the novel interconnect technology is described and how the system is performing in several target applications.

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Figures

Figure 1
Figure 1
A 20 mm×20 mm×3 mm CdZnTe detector bump bonded to the 80*80 readout ASIC.
Figure 2
Figure 2
Enclosure with readout and temperature stabilisation, see detector board lower left.
Figure 3
Figure 3
An image of X-rays from an Am-241 sealed source showing the number of events per pixel (left) and the Am-241 spectrum from a typical pixel (right).
Figure 4
Figure 4
The distribution of the FWHM of the 59.5 keV peak for all single pixels (left) and the spatial variation in FWHM per pixel (right).
Figure 5
Figure 5
A Tc-99m spectrum spectrum collected on a single pixel (left) and the distribution of the FWHM of the 141 keV peak measured on each pixel.
Figure 6
Figure 6
A XRF imaging of a catalytic body. a) Spatial distribution of the Sb fluorescence peak. b) Individual spectrum showing Sb and Pb fluorescence peaks, the later being present due to extraneous signal from the beam stop. A vertical 100 micron X-ray beam was used to image a slice through the centre of the catalyst body with the image formed using a pinhole camera.
Figure 7
Figure 7
Aluminium carriers on copper alignment block. The carrier has alignment holes, ‘door-step’ card and connector which is wire bonded to the ASIC I/O pads. A 5 mm thick CdZnTe detector is shown for demonstration.
See this image and copyright information in PMC

References

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