Polymeric packaging for fully implantable wireless neural microsensors
- PMID: 23365999
- PMCID: PMC3904293
- DOI: 10.1109/EMBC.2012.6346038
Polymeric packaging for fully implantable wireless neural microsensors
Abstract
We present polymeric packaging methods used for subcutaneous, fully implantable, broadband, and wireless neurosensors. A new tool for accelerated testing and characterization of biocompatible polymeric packaging materials and processes is described along with specialized test units to simulate our fully implantable neurosensor components, materials and fabrication processes. A brief description of the implantable systems is presented along with their current encapsulation methods based on polydimethylsiloxane (PDMS). Results from in-vivo testing of multiple implanted neurosensors in swine and non-human primates are presented. Finally, a novel augmenting polymer thin film material to complement the currently employed PDMS is introduced. This thin layer coating material is based on the Plasma Enhanced Chemical Vapor Deposition (PECVD) process of Hexamethyldisiloxane (HMDSO) and Oxygen (O(2)).
Figures






References
-
- Nurmikko Arto V., Donoghue John P., Hochberg Leigh, Patterson William R., Song Yoon-Kyu, Bull Christopher, Borton David, Laiwalla Farah, Park Sunmee, Ming Yin, Aceros Juan. Listening to Brain Microcircuits for Interfacing with External World – Progress in Wireless Implantable Microelectronic Neuroengineering Devices. Proc. IEEE (invited) 2010;98:375. - PMC - PubMed
-
- Hochberg LR, et al. Neuronal ensemble control of prosthetic devices by a human with tetraplegia. Nature. 2006;442:164–171. - PubMed
-
- Mandlik Prashant, Gartside Jonathan, Han Lin, Cheng I-Chun, Wagner Sigurd, Silvernail Jeff A., Ma Rui-Qing, Hack Michael, Brown Julie J. A single-layer permeation barrier for organic light-emitting displays. Appl. Phys. Lett. 2008;92:103309.
-
- Yin M, Borton DA, Aceros J, Patterson WR, Nurmikko AV. A hermetically packaged 100-channel fully implantable wireless neural recording system. Proc. IEEE Intl. Symp. on Circuits and Systems. 2012 May; Accepted.
Publication types
MeSH terms
Substances
Grants and funding
LinkOut - more resources
Full Text Sources
Other Literature Sources