The effect of caries excavation methods on the bond strength of etch-and-rinse and self-etch adhesives to caries affected dentine

Abstract

Background: The aim of this study was to evaluate the influence of chemomechanical caries removal and conventional caries excavation on the microtensile bond strength of three different dentine adhesive systems.

Methods: Thirty extracted human mandibular molars with radiographic signs of dental caries extending up to the middle third of dentine were sectioned longitudinally through the centre of the carious lesion in a buccolingual direction to yield two sections. One half of each tooth was excavated by tungsten carbide bur and the other half was chemomechanically treated with Carisolv(®) . Three dentine bonding systems: an etch-and-rinse single bottle adhesive (Single Bond, 3M ESPE); a two bottle, two-step self-etch bonding system (One Coat Self Etching Bond, Coltene Whaledent); and a single-step, single bottle self-etch adhesive (Adper Easy Bond Self-Etch Adhesive, 3M ESPE) were applied and composite build-up was done. The specimens were tested for microtensile bond strength. Data were analysed using two-way analysis of variance and pair-wise multiple comparisons were done using the Holm-Sidak method.

Results: The etch-and-rinse adhesive and two bottle self-etch system showed significantly higher bond strength than the single bottle self-etch system. Caries excavation method had no influence on bond strength values.

Conclusions: Carisolv(®) did not affect the microtensile bond strength values of different adhesive systems tested to the caries affected dentine.

Keywords: Carisolv®; Dentine bonding agent; acid-etching; caries affected dentine; self-etch.