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. 2014 Sep 3;26(33):5857-62.
doi: 10.1002/adma.201401736. Epub 2014 Jul 8.

Elastomeric thermal interface materials with high through-plane thermal conductivity from carbon fiber fillers vertically aligned by electrostatic flocking

Kojiro Uetani  1 , Seisuke Ata, Shigeki Tomonoh, Takeo Yamada, Motoo Yumura, Kenji Hata
Affiliations

Elastomeric thermal interface materials with high through-plane thermal conductivity from carbon fiber fillers vertically aligned by electrostatic flocking

Kojiro Uetani et al. Adv Mater. .

Abstract

Electrostatic flocking is applied to create an array of aligned carbon fibers from which an elastomeric thermal interface material (TIM) can be fabricated with a high through-plane thermal conductivity of 23.3 W/mK. A high thermal conductivity can be achieved with a significantly low filler level (13.2 wt%). As a result, this material retains the intrinsic properties of the matrix, i.e., elastomeric behavior.

Keywords: electrostatic flocking; thermal interface materials; through-plane thermal conductivity; vertically aligned carbon fibers.

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