AlN/ZnO/LiNbO3 Packageless Structure as a Low-Profile Sensor for Potential On-Body Applications

Abstract

Surface acoustic wave sensors find their application in a growing number of fields. This interest stems in particular from their passive nature and the possibility of remote interrogation. Still, the sensor package, due to its size, remains an obstacle for some applications. In this regard, packageless solutions are very promising. This paper describes the potential of the AlN/ZnO/LiNbO₃ structure for packageless acoustic wave sensors. This structure, based on the waveguided acoustic wave principle, is studied numerically and experimentally. According to the COMSOL simulations, a wave, whose particle displacement is similar to a Rayleigh wave, is confined within the structure when the AlN film is thick enough. This result is confirmed by comprehensive experimental tests, thus proving the potential of this structure for packageless applications, notably temperature sensing.