Imaging the Polymorphic Transformation in a Single Cu₆Sn₅ Grain in a Solder Joint
- PMID: 30423946
- PMCID: PMC6266603
- DOI: 10.3390/ma11112229
Imaging the Polymorphic Transformation in a Single Cu₆Sn₅ Grain in a Solder Joint
Abstract
In-situ observations of the polymorphic transformation in a single targeted Cu₆Sn₅ grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu₃Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic η'-Cu₆Sn₅ superlattice reflections appear in the hexagonal η-Cu₆Sn₅ diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η'-Cu₆Sn₅ contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.
Keywords: Cu6Sn5 intermetallic compound; electron diffraction; high-voltage transmission electron microscopy; polymorphic phase transformation; time-temperature transformation.
Conflict of interest statement
The authors declare no conflict of interest.
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