Integration of bulk materials with two-dimensional materials for physical coupling and applications

Sang-Hoon Bae^{1

2}, Hyun Kum^{1

2}, Wei Kong^{1

2}, Yunjo Kim^{1

2}, Chanyeol Choi^{2

3}, Byunghun Lee^{1

2}, Peng Lin^{1

2}, Yongmo Park^{1

2}, Jeehwan Kim^{4

5

6}

Affiliations

¹ Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
² Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
³ Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
⁴ Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.
⁵ Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.
⁶ Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.

PMID: 31114063
DOI: 10.1038/s41563-019-0335-2

Review

Integration of bulk materials with two-dimensional materials for physical coupling and applications

Sang-Hoon Bae et al. Nat Mater. 2019 Jun.

. 2019 Jun;18(6):550-560.

doi: 10.1038/s41563-019-0335-2. Epub 2019 May 21.

Authors

Sang-Hoon Bae^{1

2}, Hyun Kum^{1

2}, Wei Kong^{1

2}, Yunjo Kim^{1

2}, Chanyeol Choi^{2

3}, Byunghun Lee^{1

2}, Peng Lin^{1

2}, Yongmo Park^{1

2}, Jeehwan Kim^{4

5

6}

Affiliations

¹ Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
² Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
³ Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
⁴ Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.
⁵ Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.
⁶ Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA. jeehwan@mit.edu.

PMID: 31114063
DOI: 10.1038/s41563-019-0335-2

Abstract

Hybrid heterostructures are essential for functional device systems. The advent of 2D materials has broadened the material set beyond conventional 3D material-based heterostructures. It has triggered the fundamental investigation and use in applications of new coupling phenomena between 3D bulk materials and 2D atomic layers that have unique van der Waals features. Here we review the state-of-the-art fabrication of 2D and 3D heterostructures, present a critical survey of unique phenomena arising from forming 3D/2D interfaces, and introduce their applications. We also discuss potential directions for research based on these new coupled architectures.

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Integration of bulk materials with two-dimensional materials for physical coupling and applications

Affiliations

Integration of bulk materials with two-dimensional materials for physical coupling and applications

Authors

Affiliations

Abstract

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LinkOut - more resources

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