Skin-integrated wireless haptic interfaces for virtual and augmented reality

Xinge Yu^#¹, Zhaoqian Xie^#^{1

2

3

4

5}, Yang Yu^#^{6

7

8}, Jungyup Lee^#⁹, Abraham Vazquez-Guardado¹⁰, Haiwen Luan¹⁰, Jasper Ruban⁹, Xin Ning¹¹, Aadeel Akhtar¹², Dengfeng Li¹, Bowen Ji^{3

4

5

13}, Yiming Liu¹, Rujie Sun¹⁴, Jingyue Cao¹⁵, Qingze Huo^{3

4

5}, Yishan Zhong^{6

7}, ChanMi Lee^{6

7}, SeungYeop Kim^{6

7}, Philipp Gutruf¹⁶, Changxing Zhang¹⁷, Yeguang Xue^{3

4

5}, Qinglei Guo¹⁸, Aditya Chempakasseril^{6

7}, Peilin Tian^{6

7}, Wei Lu¹⁰, JiYoon Jeong⁹, YongJoon Yu⁹, Jesse Cornman¹², CheeSim Tan¹², BongHoon Kim^{6

7

10}, KunHyuk Lee¹⁰, Xue Feng¹⁷, Yonggang Huang^{19

20

21

22}, John A Rogers^{23

24

25

26

27

28

29

30

31}

Affiliations

¹ Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
² Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.
³ Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
⁴ Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
⁵ Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
⁶ Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
⁷ Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
⁸ School of Materials Science and Engineering, Tsinghua University, Beijing, China.
⁹ NeuroLux Corporation, Evanston, IL, USA.
¹⁰ Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
¹¹ Department of Aerospace Engineering, Pennsylvania State University, University Park, PA, USA.
¹² PSYONIC, Inc., Champaign, IL, USA.
¹³ Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China.
¹⁴ Bristol Composites Institute, University of Bristol, Bristol, UK.
¹⁵ Wearifi, Inc., Evanston, IL, USA.
¹⁶ Department of Biomedical Engineering, University of Arizona, Tucson, AZ, USA.
¹⁷ AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, China.
¹⁸ School of Microelectronics, Shandong University, Jinan, China.
¹⁹ Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
²⁰ Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
²¹ Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
²² Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
²³ Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
²⁴ Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
²⁵ Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA. jrogers@northwestern.edu.
²⁶ Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA. jrogers@northwestern.edu.
²⁷ Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
²⁸ Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
²⁹ Department of Neurological Surgery, Feinberg Medical School, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
³⁰ Department of Chemistry, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
³¹ Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.

^# Contributed equally.

PMID: 31748722
DOI: 10.1038/s41586-019-1687-0

Skin-integrated wireless haptic interfaces for virtual and augmented reality

Xinge Yu et al. Nature. 2019 Nov.

. 2019 Nov;575(7783):473-479.

doi: 10.1038/s41586-019-1687-0. Epub 2019 Nov 20.

Authors

Affiliations

¹ Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
² Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.
³ Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
⁴ Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
⁵ Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
⁶ Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
⁷ Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
⁸ School of Materials Science and Engineering, Tsinghua University, Beijing, China.
⁹ NeuroLux Corporation, Evanston, IL, USA.
¹⁰ Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
¹¹ Department of Aerospace Engineering, Pennsylvania State University, University Park, PA, USA.
¹² PSYONIC, Inc., Champaign, IL, USA.
¹³ Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China.
¹⁴ Bristol Composites Institute, University of Bristol, Bristol, UK.
¹⁵ Wearifi, Inc., Evanston, IL, USA.
¹⁶ Department of Biomedical Engineering, University of Arizona, Tucson, AZ, USA.
¹⁷ AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, China.
¹⁸ School of Microelectronics, Shandong University, Jinan, China.
¹⁹ Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
²⁰ Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
²¹ Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
²² Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
²³ Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
²⁴ Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
²⁵ Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA. jrogers@northwestern.edu.
²⁶ Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA. jrogers@northwestern.edu.
²⁷ Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
²⁸ Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
²⁹ Department of Neurological Surgery, Feinberg Medical School, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
³⁰ Department of Chemistry, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.
³¹ Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA. jrogers@northwestern.edu.

^# Contributed equally.

PMID: 31748722
DOI: 10.1038/s41586-019-1687-0

Abstract

Traditional technologies for virtual reality (VR) and augmented reality (AR) create human experiences through visual and auditory stimuli that replicate sensations associated with the physical world. The most widespread VR and AR systems use head-mounted displays, accelerometers and loudspeakers as the basis for three-dimensional, computer-generated environments that can exist in isolation or as overlays on actual scenery. In comparison to the eyes and the ears, the skin is a relatively underexplored sensory interface for VR and AR technology that could, nevertheless, greatly enhance experiences at a qualitative level, with direct relevance in areas such as communications, entertainment and medicine^1,2. Here we present a wireless, battery-free platform of electronic systems and haptic (that is, touch-based) interfaces capable of softly laminating onto the curved surfaces of the skin to communicate information via spatio-temporally programmable patterns of localized mechanical vibrations. We describe the materials, device structures, power delivery strategies and communication schemes that serve as the foundations for such platforms. The resulting technology creates many opportunities for use where the skin provides an electronically programmable communication and sensory input channel to the body, as demonstrated through applications in social media and personal engagement, prosthetic control and feedback, and gaming and entertainment.

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Comment in

Virtual and augmented reality enhanced by touch.
Tao XM. Tao XM. Nature. 2019 Nov;575(7783):453-454. doi: 10.1038/d41586-019-03506-3. Nature. 2019. PMID: 31748719 No abstract available.

References

1. Kapur, P., Jensen, M., Buxbaum, L. J., Jax, S. A. & Kuchenbecker, K. J. Spatially distributed tactile feedback for kinesthetic motion guidance. In 2010 IEEE Haptics Symp. (ed. Basodogan, C.) 519–526 (IEEE, 2010).
1. Sardini, E., Serpelloni, M. & Pasqui, V. Wireless wearable T-shirt for posture monitoring during rehabilitation exercises. IEEE Trans. Instrum. Meas. 64, 439–448 (2015). - DOI
1. Kim, Y. et al. A bioinspired flexible organic artificial afferent nerve. Science 360, 998–1003 (2018). - DOI
1. Novich, S. D. & Eagleman, D. M. Using space and time to encode vibrotactile information: toward an estimate of the skin’s achievable throughput. Exp. Brain Res. 233, 2777–2788 (2015). - DOI
1. Sundaram, S. et al. Learning the signatures of the human grasp using a scalable tactile glove. Nature 569, 698–702 (2019). - DOI

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Skin-integrated wireless haptic interfaces for virtual and augmented reality

Affiliations

Skin-integrated wireless haptic interfaces for virtual and augmented reality

Authors

Affiliations

Abstract

Comment in

References

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LinkOut - more resources

Full Text Sources

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Research Materials