Flexible Hybrid Electronics

Affiliations

¹ Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois, 60208, USA.
² Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.
³ Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.

Editorial

John A Rogers et al. Adv Mater. 2020 Apr.

. 2020 Apr;32(15):e1905590.

doi: 10.1002/adma.201905590.

¹ Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois, 60208, USA.
² Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore.
³ Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.

No abstract available

Publication types