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. 2020 Dec 23;13(1):21.
doi: 10.3390/polym13010021.

Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler

Min Jun Lee  1 , Pil Gyu Lee  1 , Il-Joon Bae  2 , Jong Sung Won  3 , Min Hong Jeon  1 , Seung Goo Lee  1
Affiliations

Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler

Min Jun Lee et al. Polymers (Basel). .

Abstract

In this study, a carbon fiber-reinforced thermoplastic composite was fabricated using a new aromatic polyamide (APA) as a matrix. Non-isothermal crystallization behaviors in the cooling process of APA resin (a semi-crystalline polymer) and composite were analyzed by using a differential scanning calorimeter (DSC). To determine the optimum molding conditions, processing parameters such as the molding temperature and time were varied during compression molding of the Carbon/APA composite. The tensile and flexural properties and morphologies of the fabricated composites were analyzed. Molding at 270 °C and 50 MPa for 5 min. showed relatively good mechanical properties and morphologies; thus, this condition was selected as the optimal molding condition. In addition, to enhance the thermal conductivity of the Carbon/APA composite, a study was conducted to add hexagonal boron nitride (h-BN) as a filler. The surface of h-BN was oxidized to increase its miscibility in the resin, which resulted in better dispersity in the APA matrix. In conclusion, a Carbon/APA (h-BN) composite manufactured under optimal molding conditions with an APA resin containing surface-treated h-BN showed a thermal conductivity more than twice that of the case without h-BN.

Keywords: aromatic polyamide; boron nitride; carbon fiber; thermal conductivity; thermoplastic composite.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Figure 1
Figure 1
Comparison of molecular structures (a) aromatic polyamide (APA)(MXD6) and (b) Polyamide 6,6.
Figure 2
Figure 2
Schematic diagram of the surface treatment procedure of h-BN.
Figure 3
Figure 3
Schematic diagram of the Carbon/APA(h-BN) composite fabrication process.
Figure 4
Figure 4
Schematic diagram of cross-plane thermal diffusivity measurement for laser flash apparatus.
Figure 5
Figure 5
Differential scanning calorimeter (DSC) melt-crystallization curves of (a) modified PA and (b) Carbon/APA composite at different cooling rates.
Figure 6
Figure 6
Relative crystallinity as a function of different cooling rates; (a) APA crystallinity over temperature, (b) Carbon/APA composite crystallinity over temperature, (c) APA crystallinity over time, and (d) Carbon/APA composite crystallinity over time.
Figure 7
Figure 7
Crystallization rate of (a) APA and (b) Carbon/APA composite at different cooling rates.
Figure 8
Figure 8
Tensile strength and modulus of Carbon/APA manufactured under different molding conditions: (a) molding time and (b) molding temperature.
Figure 9
Figure 9
Flexural strength and modulus of Carbon/APA manufactured under different molding conditions: (a) molding time and (b) molding temperature.
Figure 10
Figure 10
SEM images of cross-sectional surfaces of the Carbon/APA at different molding conditions; (a) C/APA-260, (b) C/APA-270-5, (c) C/APA-280, (d) C/APA-1, (e) C/APA-3, (f) C/APA-10.
Figure 11
Figure 11
TGA thermograms of pure h-BN.
Figure 12
Figure 12
FT-IR spectrum of pure h-BN and surface-modified h-BN.
Figure 13
Figure 13
SEM images of the APA surface with different contents of h-BN; (a) 10 wt% of non-surface-treatment h-BN, (b) 3 wt%, (c) 6 wt%, (d) 10 wt%.
Figure 14
Figure 14
EDS mapping image of the APA surface with different contents of h-BN: (a) 10 wt% of untreated h-BN; (b) 3 wt%; (c) 6 wt%; and (d) 10 wt% of surface treated h-BN.
Figure 15
Figure 15
Thermal conductivities of Carbon/APA (h-BN) with different wt% of h-BN (a) with temperature, and (b) at 160 °C.
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