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. 2021 May 26;7(5):e07092.
doi: 10.1016/j.heliyon.2021.e07092. eCollection 2021 May.

Removal of Cu (II) by calcinated electroplating sludge

Thi Huong Tran  1 , Quang Minh Tran  2 , Thi Vinh Le  2 , Thi Thuy Pham  2 , Van Trong Le  3 , Manh Khai Nguyen  2
Affiliations

Removal of Cu (II) by calcinated electroplating sludge

Thi Huong Tran et al. Heliyon. .

Abstract

Electroplating sludge consists of various heavy metal oxides, which may be utilized as adsorbent to remove Cu (II) present in aqueous environment. This study evaluated the adsorption performance of calcinated electroplating sludge. The adsorption isotherm based on Langmuir equation proved that calcinated electroplating sludge had a higher adsorption performance than raw electroplating sludge, with maximum adsorption capacity 92 mg/g and 76.34 mg/g, respectively. Findings of the conducted kinetic study revealed that both surface adsorption and intra-particular diffusion were involved during the adsorption process. Moreover, the comparison between the experimental and calculated data of equilibrium adsorption capacity demonstrated that the pseudo second-order kinetic equation fitted well with 38.31 mg/g of calcinated sludge and 33.66 mg/g of raw sludge, approximate to real-world data. Furthermore, adsorption mechanism research demonstrated that while OH group plays a vital role in raw sample, Ca2+, in addition to OH group, was involved in ion exchange in calcinated sample.

Keywords: Adsorption; Adsorption isotherm; Calcinated electroplating sludge; Cu (II) removal; Kinetic study; Raw electroplating sludge.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Figure 1
Figure 1
XRF pattern of the raw electroplating sludge.
Figure 2
Figure 2
XRD patterns of raw and calcinated electroplating sludge.
Figure 3
Figure 3
SEM image of (a) raw electroplating sludge and (b) calcinated electroplating sludge.
Figure 4
Figure 4
(a) Adsorption capacity and (b) percentage of Cu remaining in solution of raw electroplating sludge and calcinated electroplating sludge at pH = 4.8 and initial concentration = 250 mg/L.
Figure 5
Figure 5
Concentration of Cu (II) remaining in solution after shaking for 2 h at different pH levels of raw and calcinated electroplating sludge; initial concentration = 250 mg/L, shaking speed = 200 rpm in ambient temperature.
Figure 6
Figure 6
Freundlich isotherm for the adsorption of Cu (II) with raw electroplating sludge and calcinated electroplating sludge.
Figure 7
Figure 7
Langmuir isotherm for the adsorption of Cu (II) with (a) raw electroplating sludge and (b) calcinated electroplating sludge.
Figure 8
Figure 8
(a) Pseudo first-order kinetic and (b) pseudo second-order kinetic equation for adsorption of Cu (II) with raw electroplating sludge and calcinated electroplating sludge.
Figure 9
Figure 9
(a) Intra-particular diffusion kinetic and (b) Intra-particular diffusion kinetic linear for adsorption Cu (II) of raw electroplating sludge and calcinated electroplating sludge.
Figure 10
Figure 10
FTIR spectra of raw electroplating sludge and calcinated electroplating sludge.
Figure 11
Figure 11
Adsorption mechanism of raw and calcinated electroplating sludge.
See this image and copyright information in PMC

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