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. 2021 Aug 27;14(17):4869.
doi: 10.3390/ma14174869.

Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Hongpeng Jiang  1   2 , Guangqiang Yan  1   2 , Jianwei Li  1   2 , Jie Xu  1   2 , Debin Shan  1   2 , Bin Guo  1   2
Affiliations

Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Hongpeng Jiang et al. Materials (Basel). .

Abstract

Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Experimental results demonstrate that: the edge radius and V-groove angle have significant effects on the rib height and aspect ratio λ during T-shape upsetting; while the surface roughness has little effect on the forming load in the first stage, but in the second stage the influence becomes significant. The dynamic recrystallization temperature of UFG pure copper is between 200 °C and 250 °C.

Keywords: T-shape upsetting test; equal-channel angular pressing; micro-forming; pure copper; ultrafine grains.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Figure 1
Figure 1
Preparation of UFG pure Cu specimen by ECAP.
Figure 2
Figure 2
Schematic diagram of T-shape upsetting.
Figure 3
Figure 3
Analysis of T-shape upsetting process in UFG pure copper: (a) material flow rate distribution; (b) equivalent stress distribution; (c) equivalent strain distribution.
Figure 4
Figure 4
Stroke-Load curve under different surface roughness: (a) CG Cu; (b) UFG Cu.
Figure 5
Figure 5
Variation curve of the aspect ratio λ of UFG and CG pure copper with the surface roughness.
Figure 6
Figure 6
Variation curve of the aspect ratio λ of UFG and CG pure copper: (a) edge radius, (b) V-groove angle.
Figure 7
Figure 7
Stroke-Load curve under different testing temperature: (a) CG Cu; (b) UFG Cu.
Figure 8
Figure 8
Variation curve of the aspect ratio λ of UFG and CG pure copper with testing temperature.
Figure 9
Figure 9
Microhardness distribution (HV) of UFG copper under different testing temperature: (a) original specimen, (b) ambient temperature, (c) 150 °C, (d) 200 °C, (e) 250 °C, (f) 300 °C, (g) 350 °C, (h) 400 °C.
Figure 10
Figure 10
Microhardness distribution (HV) of CG copper under different testing temperature: (a) original specimen, (b) ambient temperature, (c) 150 °C, (d) 200 °C, (e) 250 °C, (f) 300 °C, (g) 350 °C, (h) 400 °C.
Figure 11
Figure 11
Microstructural evolution in primary regions of UFG pure copper after T-shape upsetting: (a) region A, (b) region B, (c) region C, (d) region D.
Figure 12
Figure 12
Microstructure after T-shape upsetting of UFG pure copper at different temperatures: (a) room temperature; (b) 150 °C; (c) 200 °C; (d) 250 °C; (e) 300 °C; (f) 350 °C; (g) 400 °C.
Figure 13
Figure 13
(a) Average grain size at different deformation temperature in UFG copper after T-shape upsetting; (b) Microhardness versus average grain size.
Figure 14
Figure 14
Grain boundary distribution of UFG pure copper under different testing temperature conditions: (a) room temperature; (b) 150 °C; (c) 200 °C; (d) 250 °C; (e) 300 °C; (f) 350 °C; (g) 400 °C.
Figure 15
Figure 15
Histogram of the misorientation distribution of UFG pure copper under different testing temperature.
Figure 16
Figure 16
KAM distribution of UFG pure copper under different testing temperature conditions: (a) room temperature; (b) 150 °C; (c) 200 °C; (d) 250 °C; (e) 300 °C; (f) 350 °C; (g) 400 °C.
Figure 17
Figure 17
(a) The quantitative analysis of the KAM distribution inside the UFG pure copper specimens with different testing temperatures, (b) The microhardness distribution at edge corner after T-shape upsetting at different temperatures.
See this image and copyright information in PMC

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