Review on the Integration of Microelectronics for E-Textile

Abstract

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

Keywords: e-textile; interconnection; microelectronics; smart textile; textile-adapted.

Figure 1

Level of electronics integration in textile: (a) textile-adapted, reprinted with permission from ref. [26]. Copyright Elsevier license no. 5107701406893. (b) textile-integrated, reprinted with permission from Taylor & Francis copy right license no. 501666551. (c) textile-based, reprinted with permission from [31]. Ghent University Textiles and Chemical Engineering.

Figure 2

Physical attachments for electronic PCB fabric USB connector, reprinted with permission from ref. [19]. Taylor & Francis with license no. 501667190.

Figure 3

Soldering of electronics and conductive wires on textile substrate, reproduced with permission from MDPI with creative common CC by license, https://www.mdpi.com/openaccess, accessed on 13 July 2021 [91].

Figure 4

Integration and connection of microelectronics on textile substrate by embroidery, Reprinted with permission from ref. [107]. Taylor & Francis with order no. 5107740253619.

Figure 5

ZSK automated LEDs sequin attachment device.

Figure 6

Hybrid solder and stiches of electronics on to textile, reprinted with permission from ref. [62]. Elsevier, with license no. 501667201.

Figure 7

Connection of electronics by non-conductive adhesive onto textile reprinted with permission from ref. [114]. Taylor & Francis order no. 501667217.

Figure 8

Thermoplastic bonding electronics on to textile, Reprinted with permission from ref. [122]. Elsevier, license no. 5107731320873.

Figure 9

Screen printing fabrication for conductive tracks, reprinted with permission from ref. [158]. Elsevier with license no. 5107681074985.

Figure 10

Graphene based biocompatible electronics. Optical microscopy image of the inverted FET on polyester (a). Image of an array of FETs on textile (b), reprinted with permission from ref. [156]. Springer Nature http://creativecommons.org/licenses/by/4.0/ accessed on 13 July 2021.

Figure 11

3D Printing with conductive and non-conductive polymer on knitting fabric with conductive (black) and nonconductive (grey) areas (left panel) (a), placing the SMD-LED in the printed holder afterwards (afterwards) (b), reprinted with permission from ref. [163]. Elsevier License no. 5107681074985.

Figure 12

Stretchable polymer encapsulation microelectronics on textile, Reprinted with permission from ref. [191]. Taylor & Francis with order no. 501617105.

Figure 13

Washable flexible and stretchable electronics, reprinted with permission from ref. [157]. ACS, Copyright © 2018, American Chemical Society.

Figure 14

Direct die to wire connection, reprinted with permission from ref. [207]. Advanced material technology, creative common attributes, https://creativecommons.org/licenses/by/4.0/ accessed on 13 July 2021.

Figure 15

Integrating perovskite solar cells with a flexible fiber, reprinted with permission from ref. [211]. Advanced material technology, creative common attributes, htpps://creative commons.org/ licenses /by/4.0/ accessed on 13 July 2021.

Figure 16

RFID chips in to flexible thread and plastic substrate, reprinted with permission from ref. [213]. Advanced material technology, creative common attributes, htpps://creative commons.org/ licenses /by/4.0/ accessed on 13 July 2021.

Figure 17

Primo1D integrate with LED [217].

Figure 18

Textile yarn twisted around LED integrated coper wire (a). Encapsulation of microelectronics and conductive threads by polymers (b), reprinted with permission from ref. [219]. MDPI, https://www.mdpi.com/openaccess, accessed on 13 July 2021.