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. 2022 Mar 18;15(6):2249.
doi: 10.3390/ma15062249.

Softened Microstructure and Properties of 12 μm Thick Rolled Copper Foil

Rui Feng  1 , Weichao Zhao  1 , Yumei Sun  1 , Xiaowen Wang  1 , Benkui Gong  1 , Baoping Chang  2 , Tianjie Feng  2
Affiliations

Softened Microstructure and Properties of 12 μm Thick Rolled Copper Foil

Rui Feng et al. Materials (Basel). .

Abstract

Up to now, 12 μm thick rolled copper foil is the thinnest rolled copper foil that can be stably produced. The softened microstructure and properties of 12 μm thick rolled copper foil were systematically studied in this paper. The softened process consists of thermal treatment at 180 °C for different times. The results show that the softened annealing texture is mainly cubic texture, and the cubic texture fraction increases with the increase in annealing time. The cubic texture fraction reaches the highest (34.4%) after annealing for 60 min. After annealing for 1-5 min, the tensile strength and the bending times decrease significantly. After annealing for 10-60 min, the tensile strength tends to be stable, and the bending times increase slightly. With the increase in annealing time, the electrical conductivity increases gradually, reaching 92% International Annealed Copper Standard (IACS) after annealing for 60 min. Electrical conductivity can be used as a fast and effective method to analyze the microstructure of metals.

Keywords: electrical properties; microstructure; properties; rolled copper foil; texture.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Figure 1
Figure 1
Morphology of copper foil surface and longitudinal section. (a) Surface morphology (SEM); (b) Surface morphology after corrosion (OM); (c) Longitudinal section morphology (SEM).
Figure 2
Figure 2
IPF diagram of EBSD orientation image of the longitudinal section of copper foil.
Figure 3
Figure 3
IPF diagram of the rolled and annealed copper foil. (a) Rolled sample; (b) 1 min; (c) 5 min; (d) 10 min; (e) 60 min.
Figure 3
Figure 3
IPF diagram of the rolled and annealed copper foil. (a) Rolled sample; (b) 1 min; (c) 5 min; (d) 10 min; (e) 60 min.
Figure 4
Figure 4
Grain boundary distribution of rolled and annealed copper foil. (a) Rolled sample; (b) 1 min; (c) 5 min; (d) 10 min; (e) 60 min.
Figure 5
Figure 5
Annealing twins formed during annealing process observed by TEM.
Figure 6
Figure 6
Effect of annealing time on the grain size of rolled and annealed copper foil. (a) Rolled sample; (b) 1 min; (c) 5 min; (d) 10 min; (e) 60 min.
Figure 7
Figure 7
ODF diagram of the rolled and annealed copper foil. (a) Rolled sample; (b) 1 min; (c) 5 min; (d) 10 min; (e) 60 min.
Figure 7
Figure 7
ODF diagram of the rolled and annealed copper foil. (a) Rolled sample; (b) 1 min; (c) 5 min; (d) 10 min; (e) 60 min.
Figure 7
Figure 7
ODF diagram of the rolled and annealed copper foil. (a) Rolled sample; (b) 1 min; (c) 5 min; (d) 10 min; (e) 60 min.
Figure 8
Figure 8
Texture orientation density of the copper foil. (a) (0°,0°→45°,0°) fiber; (b) β-fiber; (c) Position of β-fiber; (d) α-fiber.
Figure 8
Figure 8
Texture orientation density of the copper foil. (a) (0°,0°→45°,0°) fiber; (b) β-fiber; (c) Position of β-fiber; (d) α-fiber.
Figure 9
Figure 9
The textures’ fraction of the rolled and annealed copper foil.
Figure 10
Figure 10
Effect of annealing time on tensile properties of copper foil.
Figure 11
Figure 11
Bending resistance properties of the rolled and annealed copper foil.
Figure 12
Figure 12
Morphological characteristics of the copper foil annealed for 10 min. (a) Surface morphology; (b) Fracture morphology.
Figure 13
Figure 13
Surface morphology of the copper foil after bending. (a) Rolled sample; (b) 1 min; (c) 3 min.
Figure 14
Figure 14
Influence of annealing time on the conductivity of copper foil.
Figure 15
Figure 15
High-density dislocations of the rolled copper foil.
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