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. 2022 Mar 29;12(7):1127.
doi: 10.3390/nano12071127.

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

Ekaterina A Avilova  1 , Evgeniia M Khairullina  2   3 , Andrey Yu Shishov  2 , Elizaveta A Eltysheva  1 , Vladimir Mikhailovskii  2 , Dmitry A Sinev  1 , Ilya I Tumkin  2
Affiliations

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

Ekaterina A Avilova et al. Nanomaterials (Basel). .

Abstract

In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass substrates and optional laser post-processing of the recorded structures; thus, the proposed approach offers a complete manufacturing cycle, utilizing a single, commercially available, pulsed Yb fiber laser system. The potential implications of the presented research are amplified by the observation of laser-induced periodic surface structures (LIPSSs) that may be useful for the further tuning of tracks' functional properties.

Keywords: LIPSS; copper; deep eutectic solvents; direct laser writing; laser-induced metal deposition.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Figure 1
Figure 1
Laser-induced deposition technique. (a) plain glass substrate; (b) laser-induced micriplasma processing; (c) fabrication of the copper patterns under action of laser radiation; (d) rinsing away the leftovers of the DES layer; (e) air drying; (f) laser polishing (optional).
Figure 2
Figure 2
Morphology of copper tracks on (a) the original (non-treated substrate, type I), (b) laser-treated and laser-cleaned substrate (type II), and (c) laser-treated and non-cleaned substrate (type III). SEM images of different resolution (d–f), and XRD pattern and EDX mapping (h–i) of the track presented on the image (c). Laser deposition processing parameters: f = 20 kHz, τ = 200 ns; (a): V = 0.05 mm/s, P = 1.31 W; (b,c): V = 0.5 mm/s, P = 3.1 W.
Figure 3
Figure 3
Morphology of copper tracks deposited (a) without and (b) with an auxiliary glass substrate; (c) processing regime diagram depending on the processing parameters, where D is the width of the structure. The area of the conductive structure’s acquisition. (d) Profilometry of a characteristic, electrically conductive structure. Laser parameters: P = 3.1 W, V = 0.5 mm/s, f = 20 kHz, and τ = 200 ns. (e) Surface roughness of structure depending on the laser power at V = 0.5 mm/s, f = 20 kHz, and τ = 200 ns.
Figure 4
Figure 4
(a−c) Morphology of copper tracks recorded with LIPSSs formation. Two-dimensional FFT spectra of the areas with LIPSSs formation are shown on the insets. Recording regime P = 1.85 W, V = 0.05 mm/s, f = 20 kHz, τ = 200 ns, and delay duration before scanning t = 1 s. Structure period is 0.77 ± 0.15 μm, and the dispersion in the LIPSSs orientation angle (DLOA) is about 15−25 degrees.
Figure 5
Figure 5
(a–c) The continuous -coating recording scheme, (d) optical and (e) scanning electron microphotography, and (f) EDX analysis of the recorded coating structure. (g) Photo and (h) recording scheme for the structures of arbitrary topology.
See this image and copyright information in PMC

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