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. 2022 May 15;13(5):776.
doi: 10.3390/mi13050776.

Simulation of Temperature Field in Micro-EDM Assisted Machining of Micro-Holes in Printed Circuit Boards

Manqun Lian  1 , Xinke Feng  1 , Bin Xu  1 , Lianyu Fu  2 , Kai Jiang  3
Affiliations

Simulation of Temperature Field in Micro-EDM Assisted Machining of Micro-Holes in Printed Circuit Boards

Manqun Lian et al. Micromachines (Basel). .

Abstract

High-speed mechanical drilling based on the micro-bit is the mainstream process technology for machining micro-holes in the printed circuit board (PCB). However, the above process to obtain PCB micro-holes is prone to defects, such as hole burrs and nail heads in the hole. In this paper, the micro electrical discharge machining (micro-EDM) was used as an auxiliary means for machining PCB micro-holes to effectively eliminate the defects such as hole burrs and nail heads. However, during the process of micro-EDM, the micro-bit will be gradually worn, thus negatively affecting the machining quality of PCB micro-holes. To solve the above problems, in this paper, the temperature field model of micro-EDM-assisted machining of PCB micro-holes was established to predict the micro-bit wear by analyzing the temperature field with COMSOL Multiphysics software. This paper made an extensive study of the influences of spindle speed, machining voltage, and pulse width on temperature field and micro-bit wear. The simulation results show that with the increase in machining voltage and pulse width, the temperature of PCB micro-hole machining increases, resulting in an increase in micro-bit wear. The spindle rotation is beneficial to the updating of the machining medium and the discharge of heat generated from EDM. Therefore, with the increase in spindle speed, the temperature of PCB micro-hole machining and the micro-bit wear is reduced.

Keywords: micro-EDM; micro-bit wear; printed circuit board (PCB) micro-hole; temperature field.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Figure 1
Figure 1
Discharge channel.
Figure 2
Figure 2
Heat flux density of the micro-bit surface.
Figure 3
Figure 3
Micro-element on the micro-bit surface.
Figure 4
Figure 4
Simplified micro-element on the micro-bit surface.
Figure 5
Figure 5
Finite element division of the micro-element of the micro-bit.
Figure 6
Figure 6
Results of correspondence between the discharge current and the machining voltage.
Figure 7
Figure 7
(a) Temperature field of micro-drill during discharge at t = 0, (b) temperature field of micro-drill during discharge at t = 1 μs, (c) temperature field of micro-drill during discharge at t = 2 μs, (d) temperature field of micro-drill during discharge at t = 3 μs.
Figure 8
Figure 8
Variation of Tmax and T(0,0,0) with machining time.
Figure 9
Figure 9
(a) Melting area of the micro-bit; (b) edm wear of the micro-bit.
Figure 10
Figure 10
(a) T(0,0,0) variation with machining time at different machining voltages; (b) tmax variation with machining time at different machining voltages.
Figure 11
Figure 11
Micro-bit wear volume (Vm) under different machining voltage.
Figure 12
Figure 12
(a) T(0,0,0) variation with machining time at different pulse widths; (b) Tmax variation with machining time at different pulse widths.
Figure 13
Figure 13
Micro-bit wear volume (Vm) under different pulse width.
Figure 14
Figure 14
(a) T(0,0,0) variation with machining time at different spindle speeds; (b) Tmax variation with machining time at different spindle speeds.
Figure 15
Figure 15
Micro-bit wear volume (Vm) under different spindle speeds.
Figure 16
Figure 16
Laboratory Equipment.
Figure 17
Figure 17
EDM wear of the micro-bit: (a) effects of machining voltages on the micro-bit wear; (b) effect of pulse widths on the micro-bit wear; (c) effect of spindle speeds on the micro-bit wear.
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