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. 2022 Aug 26:10:970407.
doi: 10.3389/fchem.2022.970407. eCollection 2022.

Overcoming the rise in local deposit resistance during electrophoretic deposition via suspension replenishing

Prabal Tiwari  1 , Noah D Ferson  1 , David P Arnold  2 , Jennifer S Andrew  1
Affiliations

Overcoming the rise in local deposit resistance during electrophoretic deposition via suspension replenishing

Prabal Tiwari et al. Front Chem. .

Abstract

Nanomaterials have unique properties, functionalities, and excellent performance, and as a result have gained significant interest across disciplines and industries. However, currently, there is a lack of techniques that can assemble as-synthesized nanomaterials in a scalable manner. Electrophoretic deposition (EPD) is a promising method for the scalable assembly of colloidally stable nanomaterials into thick films and arrays. In EPD, an electric field is used to assemble charged colloidal particles onto an oppositely charged substrate. However, in constant voltage EPD the deposition rate decreases with increasing deposition time, which has been attributed in part to the fact that the electric field in the suspension decreases with time. This decreasing electric field has been attributed to two probable causes, (i) increased resistance of the particle film and/or (ii) the growth of an ion-depletion region at the substrate. Here, to increase EPD yield and scalability we sought to distinguish between these two effects and found that the growth of the ion-depletion region plays the most significant role in the increase of the deposit resistance. Here, we also demonstrate a method to maintain constant deposit resistance in EPD by periodic replenishing of suspension, thereby improving EPD's scalability.

Keywords: alumina; colloidal processing; electrophoretic deposition kinetics; materials assembly; scalable nanomanufacturing.

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Conflict of interest statement

The authors declare that the research was conducted in the absence of any commercial or financial relationships that could be construed as a potential conflict of interest.

Figures

FIGURE 1
FIGURE 1
Schematic showing voltages across a typical electrophoretic deposition cell used in constant-voltage mode.
FIGURE 2
FIGURE 2
Schematic showing steps involved in (A) substrate-replenish electrophoretic deposition and (B) suspension-replenish electrophoretic deposition.
FIGURE 3
FIGURE 3
(A) Schematic and (B) the corresponding photograph of the electrophoretic deposition setup.
FIGURE 4
FIGURE 4
(A) Photograph and (B) optical micrograph of a typical ⍺-alumina nanoparticles film deposited via electrophoretic deposition.
FIGURE 5
FIGURE 5
(A) Top-view SEM image and (B) Cross-sectional SEM image of the film prepared via FIB showing the porous structure of the EPD film.
FIGURE 6
FIGURE 6
Deposit resistance as a function of time for conventional electrophoretic deposition (formula image) substrate-replenish electrophoretic deposition (formula image) suspension-replenish electrophoretic deposition (formula image) of alumina nanoparticles performed at 100 V/cm in constant-voltage mode. For each type of deposition, three replicate runs were performed to calculate the average and SD in deposit resistance plotted here.
FIGURE 7
FIGURE 7
Schematic showing the ion-depletion region and deposit growth on the substrate during (A) conventional electrophoretic deposition, (B) substrate-replenish electrophoretic deposition, and (C) suspension-replenish electrophoretic deposition.
See this image and copyright information in PMC

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