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. 2023 Jan 9;23(2):765.
doi: 10.3390/s23020765.

Packaging and Optimization of a Capacitive Biosensor and Its Readout Circuit

Antonios Georgas  1 , Lampros Nestoras  1 , Aris Ioannis Kanaris  1 , Spyridon Angelopoulos  1 , Angelo Ferraro  1 , Evangelos Hristoforou  1
Affiliations

Packaging and Optimization of a Capacitive Biosensor and Its Readout Circuit

Antonios Georgas et al. Sensors (Basel). .

Abstract

In pipeline production, there is a considerable distance between the moment when the operation principle of a biosensor will be verified in the laboratory until the moment when it can be used in real conditions. This distance is often covered by an optimization and packaging process. This article described the packaging and optimization of a SARS-CoV-2 biosensor, as well as the packaging of its electronic readout circuit. The biosensor was packed with a photosensitive tape, which forms a protective layer and is patterned in a way to form a well in the sensing area. The well is meant to limit the liquid diffusion, thereby reducing the measurement error. Subsequently, a connector between the biosensor and its readout circuit was designed and 3D-printed, ensuring the continuous and easy reading of the biosensor. In the last step, a three-dimensional case was designed and printed, thus protecting the circuit from any damage, and allowing its operation in real conditions.

Keywords: 3D printing; ORDYL SY 300; biosensor optimization; electronic packaging; interdigitated electrodes.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Figure 1
Figure 1
Coating and patterning ORDYL SY 300 at gold IDE surface.
Figure 2
Figure 2
Design of the connector hosting the biosensor: (a) schematic; (b) front view; and (c) top view.
Figure 3
Figure 3
Readout circuit packaging design: (a) schematic; base (blue); bottom lid (red); top lid (green); (b) front view; and (c) top view.
Figure 4
Figure 4
Patterning square-shaped wells on capacitor sensitive area: (a) image of the patterned well; (b) image of the well in 20× magnification; (c) a droplet is placed at the well; and (d) ORDYL thickness measured with optical profilometer.
Figure 5
Figure 5
Patterning circular wells on capacitor sensitive area: (a) wells patterned on a set of capacitors; (b) a droplet is placed at the well; (c) image of the well in 20× magnification; and (d) ORDYL layer does not cover the capacitor pads.
Figure 6
Figure 6
Normalized capacitance change over time due to the binding of S protein.
Figure 7
Figure 7
Connector slicing process.
Figure 8
Figure 8
The 3D printed connector: (a) front view; (b) side view; and (c) the connection of the conductive plates to the sensor.
Figure 9
Figure 9
Slicing process of the electronic circuit packaging base.
Figure 10
Figure 10
Packaging assembly: (a) readout circuit packaging; (b) the PCB placed inside the package; and (c) the package in its final form displaying the readings of a biosensor in its LCD screen.
See this image and copyright information in PMC

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