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. 2023 Jan 19;15(3):523.
doi: 10.3390/polym15030523.

Achieving High Thermal Conductivity and Satisfactory Insulating Properties of Elastomer Composites by Self-Assembling BN@GO Hybrids

Affiliations

Achieving High Thermal Conductivity and Satisfactory Insulating Properties of Elastomer Composites by Self-Assembling BN@GO Hybrids

Xing Xie et al. Polymers (Basel). .

Abstract

With increasing heat accumulation in advanced modern electronic devices, dielectric materials with high thermal conductivity (λ) and excellent electrical insulation have attracted extensive attention in recent years. Inspired by mussel, hexagonal boron nitride (hBN) and graphene oxide (GO) are assembled to construct mhBN@GO hybrids with the assistance of poly(catechol-polyamine). Then, mhBN@GO hybrids are dispersed in carboxy nitrile rubber (XNBR) latex via emulsion coprecipitation to form elastomer composites with a high λ and satisfactory insulating properties. Thanks to the uniform dispersion of mhBN@GO hybrids, the continuous heat conduction pathways exert a significant effect on enhancing the λ and decreasing the interface thermal resistance of XNBR composites. In particular, the λ value of 30 vol% mhBN@GO/XNBR composite reaches 0.4348 W/(m·K), which is 2.7 times that of the neat XNBR (0.1623 W/(m·K)). Meanwhile, the insulating hBN platelets hinder the electron transfer between adjacent GO sheets, leading to satisfactory electrical insulation in XNBR composites, whose AC conductivity is as low as 10-10 S/cm below 100 Hz. This strategy opens up new prospects in the assembly of ceramic and carbonaceous fillers to prepare dielectric elastomer composites with high λ and satisfactory electrical insulation, making them promising for modern electrical systems.

Keywords: dielectric; insulating properties; self-assembling; surface modification; thermal conductivity.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Figure 1
Figure 1
(a) Preparation of mhBN@GO hybrids and mhBN@GO/XNBR composites. (b) The reaction mechanism between catechol and tetraethylenepentamine.
Figure 2
Figure 2
TGA curves of hBN, mhBN, and mhBN@GO.
Figure 3
Figure 3
XPS spectra and decomposed C 1s spectra of (a) hBN, (b) mhBN, and (c) mhBN@GO.
Figure 4
Figure 4
HR-TEM images of (a) hBN, (b) mhBN, and (c) mhBN@GO.
Figure 5
Figure 5
Cross-sectional SEM images of (a) 10 vol% hBN/XNBR, (b) 20 vol% hBN/XNBR, (c) 30 vol% hBN/XNBR, (d) 10 vol% mhBN@GO/XNBR, (e) 20 vol% mhBN@GO/XNBR, and (f) 30 vol% mhBN@GO/XNBR composites. The red arrows represent the orientated dispersion of mhBN@GO.
Figure 6
Figure 6
Mechanical properties of (a) hBN/XNBR and (b) mhBN@GO/XNBR composites.
Figure 7
Figure 7
(a,b) Dielectric constant, (c,d) dielectric loss tangent, and (e,f) AC conductivity as functions of frequency for hBN/XNBR and mhBN@GO/XNBR composites, respectively.
Figure 8
Figure 8
(a) The λ of hBN/XNBR and mhBN@GO/XNBR composites with different filler loading. (b) The enhancement in λ of hBN/XNBR and mhBN@GO/XNBR composites relative to that of the neat XNBR. (c) Fitting λ of hBN/XNBR and mhBN@GO/XNBR composites using the modified Hashin-Shtrikman model.
Figure 9
Figure 9
Schematic models of phonon transmission in hBN/XNBR and mhBN@GO/XNBR composites.

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