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. 2023 Mar 14;16(6):2340.
doi: 10.3390/ma16062340.

Low-Temperature Sintering of Ag Composite Pastes with Different Metal Organic Decomposition Additions

Affiliations

Low-Temperature Sintering of Ag Composite Pastes with Different Metal Organic Decomposition Additions

Zixuan Xu et al. Materials (Basel). .

Abstract

Rapid developments in wide-bandgap semiconductors have led to the demand for interconnection materials that can withstand harsh conditions. In this study, novel Ag composite pastes were developed with the assistance of metal organic decomposition (MOD) to significantly reduce the sintering temperature of commercial Ag pastes. The effects of the decomposition characteristics of different MODs on the microstructure, morphology, and the shear strength of the Ag-sintered joints were systematically investigated. Additionally, the low-temperature sintering mechanisms of the MOD-assisted Ag composite pastes were studied and proposed. Among all the MODs studied, the one consisting of propylamine complexed with silver oxalate demonstrated the best performance due to its ability to form Ag nanoclusters with the smallest size (~25 nm) and highest purity (~99.07 wt.%). Notably, the bonding temperature of the MOD-modified Ag pastes decreased from 250 °C to 175 °C, while the shear strength increased from 20 MPa to 40.6 MPa when compared to the commercial Ag pastes.

Keywords: Ag composite pastes; MOD; low-temperature sintering; shear strength.

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Conflict of interest statement

The authors declare no conflicts of interest.

Figures

Figure 1
Figure 1
Schematic illustration of MOD preparations.
Figure 2
Figure 2
Preparation process of Ag pastes and sintered joints.
Figure 3
Figure 3
UV–visible and IR spectra of different MODs: (a) UV–visible spectra of different MODs, (b) IR spectra of different MODs.
Figure 4
Figure 4
TG-DSC curves of different MOD and silver oxalate (Arrow direction represents endothermic reaction): (a) MOD1, (b) MOD2, (c) MOD3, (d) MOD4, (e) MOD5, (f) MOD6, (g) MOD7, (h) silver oxalate.
Figure 5
Figure 5
SEM images of sintered products of different MOD: (a) MOD1, (b) MOD2, (c) MOD3, (d) MOD4, (e) MOD5, (f) MOD6, (g) MOD7.
Figure 6
Figure 6
EDS results sintered products of different MOD: (a) MOD1, (b) MOD2, (c) MOD3, (d) MOD4, (e) MOD5, (f) MOD6, (g) MOD7.
Figure 7
Figure 7
Decomposition mechanisms of different MODs: (a) MOD1, MOD6; (b) MOD2, MOD3, MOD7; (c) MOD4, MOD5.
Figure 8
Figure 8
DSC curves of different Ag composite pastes (Arrow direction represents endothermic reaction): (a) Ag/MOD1, (b) Ag/MOD2, (c) Ag/MOD3, (d) Ag/MOD4, (e) Ag/MOD5, (f) Ag/MOD6, (g) Ag/MOD7, (h) Ag.
Figure 9
Figure 9
Morphology of Ag-sintered films of different composite pastes with: (a) MOD1, (b) MOD2, (c) MOD3, (d) MOD4, (e) MOD5, (f) MOD6, (g) MOD7, (h) pure Ag powders.
Figure 10
Figure 10
Resistivity of different Ag paste-sintered films.
Figure 11
Figure 11
(ac) The schematic diagram of a MOD-assisted sintering mechanism ((d) presents an enlarged view of a specific area in (b)).
Figure 12
Figure 12
Shear strength of different Ag sintering joints: M1–M7 and pure Ag without MOD.
Figure 13
Figure 13
The fracture structures of different Ag sintering joints: (a) Ag/MOD1, (b) Ag/MOD2, (c) Ag/MOD3, (d) Ag/MOD4, (e) Ag/MOD5, (f) Ag/MOD6, (g) Ag/MOD7, (h) Ag.

References

    1. Dastgeer G., Afzal A.M., Jaffery S.H.A., Imran M., Assiri M.A., Nisar S. Gate modulation of the spin current in graphene/WSe2 van der Waals heterostructure at room temperature. J. Alloys Compd. 2022;919:165815. doi: 10.1016/j.jallcom.2022.165815. - DOI
    1. Dastgeer G., Shahzad Z.M., Chae H., Kim Y.H., Ko B.M., Eom J. Bipolar Junction Transistor Exhibiting Excellent Output Characteristics with a Prompt Response against the Selective Protein. Adv. Funct. Mater. 2022;32:2204781. doi: 10.1002/adfm.202204781. - DOI
    1. Dastgeer G., Nisar S., Shahzad Z.M., Rasheed A., Kim D., Jaffery S.H.A., Wang L., Usman M., Eom J. Low-Power Negative-Differential-Resistance Device for Sensing the Selective Protein via Supporter Molecule Engineering. Adv. Sci. 2022;10:2204779. doi: 10.1002/advs.202204779. - DOI - PMC - PubMed
    1. Xu Z., Tang Y., Rommel M. Foreword to the special issue on wide-bandgap (WBG) semiconductors: From fundamentals to applications. Nanotechnology. 2020;3:187. doi: 10.1016/j.npe.2021.01.001. - DOI
    1. Li J., Xu Y., Zhao X., Meng Y., Yin Z., Wang Y., Suga T. Enhancement and Mechanism of Copper Nanoparticle Sintering in Activated Formic Acid Atmosphere at Low Temperature. ECS J. Solid State Sci. Technol. 2021;10:5. doi: 10.1149/2162-8777/abfd4a. - DOI