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. 2023 Mar 7;13(6):964.
doi: 10.3390/nano13060964.

Surface Modification Using MAPLE Technique for Improving the Mechanical Performance of Adhesive Joints

Valentina Dinca  1 , Gabriela Toader  2 , Raluca Gavrila  3 , Oana Brincoveanu  3 , Adrian Dinescu  3 , Edina Rusen  4 , Aurel Diacon  2   4 , Alexandra Mocanu  4
Affiliations

Surface Modification Using MAPLE Technique for Improving the Mechanical Performance of Adhesive Joints

Valentina Dinca et al. Nanomaterials (Basel). .

Abstract

The adhesive bonds that ensure the appropriate mechanical properties for metal joining imply the surface chemical and wetting modification characteristics of the substrates. In this work, matrix-assisted pulsed laser evaporation (MAPLE) was used for the surface modification of Al via the deposition of two chemical compounds, polyvinyl alcohol (PVA) and triethanolamine (TEA), from frozen aqueous solutions. The deposition of the TEA and PVA layers was evidenced by FT-IR, SEM, and AFM analysis. The contact angle measurements evidenced the change in the hydrophilicity of the surface and surface free energies. The performance of the commercial silyl-based polymer adhesive Bison Max Repair Extreme Adhesive® was evaluated by tensile strength measurements. This method led to a change in tensile strength of 54.22% in the case of Al-TEA and 36.34% for Al-PVA compared with the control. This study gives preliminary insights into using MAPLE, for the first time in adhesive applications, as a pretreatment method for Al plates for adhesive bonding reinforcement.

Keywords: adhesive bonding; aluminum plates; matrix-assisted pulsed laser evaporation (MAPLE); polyvinyl alcohol; surface modification; thin film; triethanolamine.

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Conflict of interest statement

The authors declare no conflict of interest.

Figures

Scheme 1
Scheme 1
MAPLE set-up for obtaining the modified Al plates with PVA and TEA, respectively.
Scheme 2
Scheme 2
Applied MAPLE technique for surface pretreatment of Al plates for lap-joint tensile mechanical test.
Figure 1
Figure 1
SEM micrographs for blank Al substrates (a) and modified Al plates with PVA (b) and TEA (c), respectively, via the MAPLE technique; scale bar: 10 μm.
Figure 1
Figure 1
SEM micrographs for blank Al substrates (a) and modified Al plates with PVA (b) and TEA (c), respectively, via the MAPLE technique; scale bar: 10 μm.
Figure 2
Figure 2
AFM images of PVA (a,b) and TEA (c,d) after deposition on Si plates by MAPLE, acquired as 2D and 3D renders, respectively. Scan size: 5 μm.
Figure 3
Figure 3
Tensile test measurements for the Al (blank), Al-PVA, and Al-TEA samples bonded by Bison Max Repair commercial adhesive.
Scheme 3
Scheme 3
Possible orientation of the PVA or TEA structures between the Al substrate and the adhesive layer.
See this image and copyright information in PMC

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