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. 2024 Jan 24;2(2):298-304.
doi: 10.1021/acsaenm.3c00535. eCollection 2024 Feb 23.

Low-Temperature Solution-Based Molybdenum Oxide Memristors

Affiliations

Low-Temperature Solution-Based Molybdenum Oxide Memristors

Raquel Azevedo Martins et al. ACS Appl Eng Mater. .

Abstract

Solution-based memristors have gained significant attention in recent years due to their potential for the low-cost, scalable, and environmentally friendly fabrication of resistive switching devices. This study is focused on the fabrication and characterization of solution-based molybdenum trioxide (MoO3) memristors under different annealing temperatures (200 to 400 °C). A MoO3 ink recipe is developed using water as the main solvent, enabling a simplified and cost-effective fabrication process. Material analysis reveals the presence of a Mo6+ oxidation state and an amorphous structure in the films annealed up to 250 °C. Electrical tests confirm a bipolar resistive switching behavior in the memristors according to the valence change mechanism (VCM). Endurance tests demonstrate stable memristors, indicating their robust nature after multiple cycles. Memristors annealed at 250 °C exhibit a nonvolatile behavior with a retention time up to 105 s under ambient air conditions. The high reproducibility observed in these memristors highlights their potential for practical applications and scalability.

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Conflict of interest statement

The authors declare no competing financial interest.

Figures

Figure 1
Figure 1
TG-DSC curve of the precursor solution (0.1 M).
Figure 2
Figure 2
(a) XRD diffractograms, (b) optical transmittance, (c) Mo 3d emission, and (d) O 1s emission of the MoO3 thin films annealed at different temperatures. (e) AFM 3D images of the surface roughness in each condition (200, 250, and 300 °C).
Figure 3
Figure 3
Endurance tests of the MoO3 memristors annealed at different temperatures: (a) 200, (b) 250, and (c) 300 °C, respectively. On/off ratio of each device at (d) 200, (e) 250, and (f) 300 °C.
Figure 4
Figure 4
(a) Device-to-device variation of set and reset voltages in the sample with devices annealed at 250 °C. (b) AFM 3D image of the surface roughness of the sample MoO3 (0.2 M) annealed at 250 °C. (c) IV curves obtained from endurance tests on devices with an active layer of MoO3 with 0.2 M. (d) Retention characteristics with read at −0.1 V during 105 s for the HRS (black) and the LRS (red) of the same device.

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