Direct Electrodeposition of Electrically Conducting Ni3(HITP)2 MOF Nanostructures for Micro-Supercapacitor Integration
- PMID: 38698603
- DOI: 10.1002/smll.202401509
Direct Electrodeposition of Electrically Conducting Ni3(HITP)2 MOF Nanostructures for Micro-Supercapacitor Integration
Abstract
Micro-supercapacitors emerge as an important electrical energy storage technology expected to play a critical role in the large-scale deployment of autonomous microdevices for health, sensing, monitoring, and other IoT applications. Electrochemical double-layer capacitive storage requires a combination of high surface area and high electronic conductivity, with these being attained only in porous or nanostructured carbons, and recently found also in conducting metal-organic frameworks (MOFs). However, techniques for conformal deposition at micro- and nanoscale of these materials are complex, costly, and hard to upscale. Herein, the study reports direct, one step non-sacrificial anodic electrochemical deposition of Ni3(2,3,6,7,10,11-hexaiminotriphenylene)2 - Ni3(HITP)2, a porous and electrically conducting MOF. Employing this strategy enables the growth of Ni3(HITP)2 films on a variety of 2D substrates as well as on 3D nanostructured substrates to form Ni3(HITP)2 nanotubes and Pt@ Ni3(HITP)2 core-shell nanowires. Based on the optimal electrodeposition protocols, Ni3(HITP)2 films interdigitated micro-supercapacitors are fabricated and tested as a proof of concept.
Keywords: MOFs nanostructure; anodic electrodeposition; micro‐supercapacitor; non‐sacrificial.
© 2024 Wiley‐VCH GmbH.
References
-
- J. Liu, X. Song, T. Zhang, S. Liu, H. Wen, L. Chen, Angew. Chem., Int. Ed. 2021, 60, 5612.
-
- R. A. Kharod, J. L. Andrews, M. Dincă, Annu. Rev. Mater. Res. 2022, 52, 103.
-
- W. Zhao, T. Chen, W. Wang, B. Jin, J. Peng, S. Bi, M. Jiang, S. Liu, Q. Zhao, W. Huang, Sci. Bull 2020, 65, 1803.
-
- D. Sheberla, J. C. Bachman, J. S. Elias, C. J. Sun, Y. Shao‐Horn, M. Dincǎ, Nat. Mater. 2017, 16, 220.
-
- H. T. B. Pham, J. Y. Choi, S. Huang, X. Wang, A. Claman, M. Stodolka, S. Yazdi, S. Sharma, W. Zhang, J. Park, J. Am. Chem. Soc. 2022, 144, 10615.
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