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. 2024 Aug 28;24(17):5565.
doi: 10.3390/s24175565.

Development of a Screening Platform for Optimizing Chemical Nanosensor Materials

Affiliations

Development of a Screening Platform for Optimizing Chemical Nanosensor Materials

Larissa Egger et al. Sensors (Basel). .

Abstract

Chemical sensors, relying on changes in the electrical conductance of a gas-sensitive material due to the surrounding gas, typically react with multiple target gases and the resulting response is not specific for a certain analyte species. The purpose of this study was the development of a multi-sensor platform for systematic screening of gas-sensitive nanomaterials. We have developed a specific Si-based platform chip, which integrates a total of 16 sensor structures. Along with a newly developed measurement setup, this multi-sensor platform enables simultaneous performance characterization of up to 16 different sensor materials in parallel in an automated gas measurement setup. In this study, we chose the well-established ultrathin SnO2 films as base material. In order to screen the sensor performance towards type and areal density of nanoparticles on the SnO2 films, the films are functionalized by ESJET printing Au-, NiPt-, and Pd-nanoparticle solutions with five different concentrations. The functionalized sensors have been tested toward the target gases: carbon monoxide and a specific hydrogen carbon gas mixture of acetylene, ethane, ethne, and propene. The measurements have been performed in three different humidity conditions (25%, 50% and 75% r.h.). We have found that all investigated types of NPs (except Pd) increase the responses of the sensors towards CO and HCmix and reach a maximum for an NP type specific concentration.

Keywords: hybrid nanomaterials; metal oxide gas sensors; nanoparticles; nanosensors.

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Conflict of interest statement

Author Larissa Egger employed by the company Microelectronics. The remaining authors declare that the research was conducted in the absence of any commercial or financial relationships that could be construed as a potential conflict of interest.

Figures

Figure 1
Figure 1
2 × 2 cm2 sized Si-based platform chip integrating 16 sensor devices. The chip enables conductive sensor measurement in a 4-point measurement configuration and exhibits 64 contact pads for the gas sensors; 2 additional pads are required for the Pt100-like temperature sensor. The red rectangle designates the “hot area” heated by the Au-coated Cu-block underneath. The insert shows a final processed 100 × 50 µm2 sized SnO2 film; the active sensor area between the electrodes measures 30 × 50 µm2.
Figure 2
Figure 2
(a) Measurement setup (“open state”) consisting of a holder for the platform chip and a lid with gas inlet, electrical connectors, and contact pins. (b): Front view of the lid, which holds two prober heads with a total of 66 contact pins. (c) The platform chip is placed on a massive heater block (fabricated with copper, coated with gold) which heats the central part of the chip from underneath up to 350 °C. As soon as the lid is closed, the pins contact 66 Ti/Pt pads on the platform chip and enable simultaneous characterization of all 16 sensor structures in parallel.
Figure 3
Figure 3
Left: Schematic of an ESJET system. A capillary (“emitter”) with the printing ink and a needle electrode is positioned a short distance above the grounded substrate. Right: ESJET nozzle positioned above a single SnO2 sensor film on the Si-platform chip; the NP-dot diameter matches the active area of the sensor films, which measures 30 × 50 µm2.
Figure 4
Figure 4
Printing scheme of the NP solutions with different NP concentrations (1:1, 1:2, 1:4, 1:8, 1:16) on the SnO2 sensor films on the Si-platform chips. Two sensors, respectively, are functionalized with the same NP concentration; six SnO2 sensor films are not functionalized and form the reference sensors.
Figure 5
Figure 5
SEM graph of Sensor A, which is functionalized with Au-NPs; the Au-NPs can be clearly seen as white dots.
Figure 6
Figure 6
Transmission electron microscopy images of the noble metal NP batches used for sensor functionalization. Scale bars: 200 nm (left column), and 50 nm (right column). All particle batches showed approximately spherical particle shapes with average diameters of 5.3 ± 0.5 nm, 4.4 ± 0.5 nm, and 3.3 ± 0.4 nm for the Au, Pd, and NiPt material systems, respectively.
Figure 7
Figure 7
Typical resistance behavior of bare and an Au-NP functionalized SnO2 sensors (black and red curves, respectively) during exposure to 50 ppm of CO and HCmix at 300 °C operation temperature (bottom red) at 50%, 25% and 75% humidity levels (bottom black).
Figure 8
Figure 8
Response of bare SnO2 sensors and SnO2 sensors functionalized with different concentrations of Au-NP inks towards (a) 50 ppm CO, and (b) 50 ppm HCmix at 300 °C operation temperature.
Figure 9
Figure 9
Response of bare SnO2 sensors and SnO2 sensors functionalized with different concentrations of NiPt-NP inks towards (a) 50 ppm CO, and (b) 50 ppm HCmix at 300 °C operation temperature.
Figure 10
Figure 10
Response of bare SnO2 sensors and SnO2 sensors functionalized with different concentrations of Pd-NP inks towards (a) 50 ppm CO, and (b) 50 ppm HCmix at 300 °C operation temperature.
Figure 11
Figure 11
Response of sensors functionalized with Au, Pd, and NiPt-NPs with different concentrations towards (a) 50 ppm CO, and (b) 50 ppm HCmix at 50% rh and 300 °C operation temperature normalized to the response of bare SnO2 sensors.
Figure 12
Figure 12
Proposed CMOS-integrated multi-sensor device. By using proper combinations of MOx film, and types of NPs on the 8 µhps (exemplarily shown for 4 µhps), we will realize a 5 × 5 mm2 sized multi-gas sensor device capable of simultaneous detection of several target gases.

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