Identifying Ordinal Similarities at Different Temporal Scales
- PMID: 39766645
- PMCID: PMC11727087
- DOI: 10.3390/e26121016
Identifying Ordinal Similarities at Different Temporal Scales
Abstract
This study implements the permutation Jensen-Shannon distance as a metric for discerning ordinal patterns and similarities across multiple temporal scales in time series data. Initially, we present a numerically controlled analysis to validate the multiscale capabilities of this method. Subsequently, we apply our methodology to a complex photonic system, showcasing its practical utility in a real-world scenario. Our findings suggest that this approach is a powerful tool for identifying the precise temporal scales at which two distinct time series exhibit ordinal similarity. Given its robustness, we anticipate that this method could be widely applicable across various scientific disciplines, offering a new lens through which to analyze time series data.
Keywords: Jensen–Shannon divergence; chaotic semiconductor laser; delayed optical feedback; multiscale analysis; ordinal patterns; ordinal similarity; permutation Jensen–Shannon distance; permutation entropy; symbolic analysis; time series.
Conflict of interest statement
The authors declare no conflicts of interest. The funders had no role in the design of the study; in the collection, analyses, or interpretation of the data; in the writing of the manuscript; or in the decision to publish the results.
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References
-
- Serrà J., Arcos J.L. An empirical evaluation of similarity measures for time series classification. Knowl.-Based Syst. 2014;67:305–314. doi: 10.1016/j.knosys.2014.04.035. - DOI
-
- Górecki T., Łuczak M., Piasecki P. An exhaustive comparison of distance measures in the classification of time series with 1NN method. J. Comput. Sci. 2024;76:102235. doi: 10.1016/j.jocs.2024.102235. - DOI
-
- Li W., He R., Liang B., Yang F., Han S. Similarity measure of time series with different sampling frequencies based on context density consistency and dynamic time warping. IEEE Signal Process. Lett. 2023;30:1417–1421. doi: 10.1109/LSP.2023.3316010. - DOI
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