The Multi-Objective Optimization of a Dual C-Type Gold Ribbon Interconnect Structure Considering Its Geometrical Parameter Fluctuation

Abstract

With the increasing demand for high integration, low cost, and large capacities in satellite systems, integrating the antenna and microwave component into the same system has become appealing to the satellite engineer. The dual C-type gold ribbon, performing as the key electromagnetic signal bridge between the microwave component and the antenna, has a significant impact on the electrical performance of satellite antennas. However, during its manufacturing and operating, the interconnection geometry undergoes deformation due to mounting errors and environmental loads. Consequently, these parasitic geometry parameters can significantly increase energy loss during the signal transmission. To address this issue, this paper has proposed a method for determining the design range of the geometrical parameters of the dual C-type gold ribbon, and applied it to the performance prediction of the microstrip antennas and the parameter optimization of the gold ribbon. In this study, a mechanical response analysis of the antennas in the operating environment has been carried out and the manufacturing disturbance has been considered to calculate the geometry fluctuation range. Then, the significance ranking of the geometry parameters has been determined and the key parameters have been selected. Finally, the chaos feedback adaptive whale optimization algorithm-back propagation neural network has been used as a surrogate model to establish the relationship between the geometry parameters and the antenna electromagnetic performance, and the multi-objective red-billed blue magpie optimization algorithm has been combined with the surrogate model to optimize the configuration parameters. This paper provides theoretical guidance for the interconnection geometry design and the optimization of the integration module of the antennas and microwave components.

Keywords: dual C-type gold ribbon interconnection; electromagnetic performance; fluctuation range; intelligent prediction; multi-objective optimization.

Figure 1

Parameterization of the dual C-type gold ribbon interconnect structure.

Figure 2

Test sample and electromagnetic simulation model of the dual C-type gold ribbon interconnect structure.

Figure 3

Comparison between simulation results and test results: (a) the comparison of return loss S₁₁ and (b) the comparison of insertion loss S₁₁.

Figure 4

The model of the microstrip antenna with the dual C-type gold ribbon.

Figure 5

Comparison of the electrical performance of the microstrip antennas with/without the dual C-type gold ribbon interconnection structure: (a) the comparison of return loss S₁₁ and (b) the comparison of gain G.

Figure 6

FEA model of the C-type gold ribbon interconnect structure.

Figure 7

The cloud pictures of the displacement of the FEA model under random vibration loads.

Figure 8

The cloud pictures of the displacement of the FEA model under thermal load.

Figure 9

Trends of the electrical performance indicators corresponding to the different levels of the configuration parameters. (a) Impact on parameter S₁₁; (b) impact on parameter G.

Figure 10

The range and F-value of the core regulatory parameters considering interaction effects: (a) the electrical performance indicator is S₁₁; (b) the electrical performance indicator is G.

Figure 11

Comparison of the performance indicators for the CFAWOA-BP model prediction results: (a) comparison of return loss S₁₁; (b) comparison of gain G.

Figure 12

Trends of the influence of two key configuration parameters on the electrical performance indicators of the microstrip antennas. (a) The bending length S. (b) The coaxial dielectric substrate module gap Ga.

Figure 13

Variation in dielectric loss and gain under different materials.

Figure 14

Trend of antennas’ gain variation with equivalent conductivity.